SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
Cargue la imagen en el visor de la galería, SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
Cargue la imagen en el visor de la galería, SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
Cargue la imagen en el visor de la galería, SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
Cargue la imagen en el visor de la galería, SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
Cargue la imagen en el visor de la galería, SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
Cargue la imagen en el visor de la galería, SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
Cargue la imagen en el visor de la galería, SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ
Cargue la imagen en el visor de la galería, SS T12A-M6 Mainboard Layered Heating Station for IPhone X-11 Pro MAX BGA Desoldering NAND CPU PCB Glue Removing Platform - ORIWHIZ

Marca: Sunshine

Código de producto: 2101320

Disponibilidad:50 piezas restantes (Bajo stock) se enviarán dentro de las 24 horas

$57.70 - $58.70
$57.70 57.70

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